Signal spectrum selection-free heat insulation film and preparation process thereof

• Main Authors: WANG XIN, LIU FAN, WANG LANFANG, ZHAO QIANGGUO, WANG CHENXIN, BEN XIAOYAN
• Format: Patent
• Language: Chinese; English
• Published: 25.08.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

The invention belongs to the technical field of film materials, and particularly relates to a signal spectrum selection-free heat insulation film and a preparation process thereof. The heat insulation film provided by the invention comprises a release film, an ultraviolet blocking pressure-sensitive adhesive layer, a second polyester layer, a spectrum selection heat insulation layer, a first polyester layer and a scratch-resistant layer from inside to outside, wherein the spectrum selection thermal insulation layer contains a thermal insulation material, an adhesive, a titanium nitride compound, a curing agent and a solvent; and the thermal insulation material is modified doped tungsten oxide. The heat insulation window film with the spectrum selection function and without blocking the signals, provided by the invention, has a composite structure and is formed by integrally compounding a scratch-resistant layer, a first polyester film or polycarbonate film base material, a spectrum selection heat insulation a