Interposer, semiconductor package assembly and method of forming same
An embodiment semiconductor package assembly may include: an interposer; an integrated passive device electrically coupled to the first side of the interposer; an underfill material portion formed between the integrated passive device and the first side of the interposer; and a dam protruding from t...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
22.08.2023
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | An embodiment semiconductor package assembly may include: an interposer; an integrated passive device electrically coupled to the first side of the interposer; an underfill material portion formed between the integrated passive device and the first side of the interposer; and a dam protruding from the first side of the interposer and configured to constrain a spatial extent of the underfill material portion. The dam may include a first portion extending over a surface of the first side of the interposer and a second portion embedded under the surface of the first side of the interposer. The dam may be formed in a dielectric layer that also includes members that redistribute the interconnect structure. The dam may be further electrically isolated from the redistribution interconnect structure and may be configured to form a connected or disconnected boundary of a two-dimensional region of the first side of the interposer.
一种实施例半导体封装组件可包括:中介层;集成被动装置,电性耦接到中介层的第一侧;底部填充材料部分,形成于集成被动装置与中介层的第一侧之间;以及坝,从中介层的第一侧突出,且配置用于 |
---|---|
Bibliography: | Application Number: CN202310384524 |