Interposer, semiconductor package assembly and method of forming same

• Main Authors: LIN MENGLIANG, CHEN XIANWEI, ZHENG XINPU
• Format: Patent
• Language: Chinese; English
• Published: 22.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An embodiment semiconductor package assembly may include: an interposer; an integrated passive device electrically coupled to the first side of the interposer; an underfill material portion formed between the integrated passive device and the first side of the interposer; and a dam protruding from the first side of the interposer and configured to constrain a spatial extent of the underfill material portion. The dam may include a first portion extending over a surface of the first side of the interposer and a second portion embedded under the surface of the first side of the interposer. The dam may be formed in a dielectric layer that also includes members that redistribute the interconnect structure. The dam may be further electrically isolated from the redistribution interconnect structure and may be configured to form a connected or disconnected boundary of a two-dimensional region of the first side of the interposer. 一种实施例半导体封装组件可包括：中介层；集成被动装置，电性耦接到中介层的第一侧；底部填充材料部分，形成于集成被动装置与中介层的第一侧之间；以及坝，从中介层的第一侧突出，且配置用于