Package and method of forming same

• Main Authors: CHEN YINGRU, CHEN SHUOMAO, LIN MENGLIANG, ZHENG XINPU, CHEN XIANWEI
• Format: Patent
• Language: Chinese; English
• Published: 22.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

In accordance with an embodiment of the present application, a method of forming a package includes forming a first package component including an interposer and a first die bonded to a first side of the interposer. A second die is bonded to the second side of the interposer. The second die includes a substrate and a through-via penetrating the substrate. The method further includes bonding a second package component to the first package component through a plurality of first solder regions. The first package component is also electrically connected to the second package component through a through-via in the second die. The second die is also bonded to the second package component through a plurality of second solder regions. In accordance with other embodiments of the present application, a package is provided. 根据本申请的实施例，提供了一种形成封装件的方法包括形成第一封装组件，其包括中介层和接合到中介层的第一侧的第一管芯。第二管芯接合到中介层的第二侧。第二管芯包括衬底和贯穿衬底的贯通孔。该方法还包括通过多个第一焊料区域将第二封装组件接合到第一封装组件。第一封装组件还通过第二管芯中的贯通孔电连接到第二封装组件。第二管芯还通过多个第二焊料区域接合到第二封装组件。根据本申请的其他实施例，提供了封装件。