Granulating and polishing all-in-one machine

• Main Authors: YANG YUANYUAN, WANG XIAOCHENG, XIAO QUNFENG, TANG QIANYONG, QI SHIMAO, HE BI, WU WEIQUAN
• Format: Patent
• Language: Chinese; English
• Published: 15.08.2023
• Subjects: CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY; CHEMISTRY; CLEANING; CLEANING IN GENERAL; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; FERTILISERS; FERTILISERS CHARACTERISED BY THEIR FORM; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MANUFACTURE THEREOF; METALLURGY; MIXTURES OF FERTILISERS COVERED INDIVIDUALLY BY DIFFERENTSUBCLASSES OF CLASS C05; MIXTURES OF ONE OR MORE FERTILISERS WITH MATERIALS NOT HAVINGA SPECIFIC FERTILISING ACTIVITY, e.g. PESTICIDES,SOIL-CONDITIONERS, WETTING AGENTS; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; POLISHING; PREVENTION OF FOULING IN GENERAL; THEIR RELEVANT APPARATUS; TRANSPORTING

The invention provides a granulating and polishing all-in-one machine which comprises an all-in-one machine body, the all-in-one machine body comprises a discharging mechanism, a top frame, a bottom frame, a driving assembly and a polishing assembly, the discharging mechanism is installed on the surface of the top frame, and a polishing interlayer is arranged between the top frame and the bottom frame; the granulating and polishing all-in-one machine comprises a top frame, a bottom frame and a driving assembly, the driving assembly is installed in the middle of the top frame and the middle of the bottom frame, a plurality of polishing assemblies are installed at the bottom of the driving assembly, and a discharging pipeline is arranged below the bottom frame. The particle cutting and polishing processes can be completed at the same time by matching with the discharging mechanism at the top and the polishing assembly at the bottom, the power structure is simplified, the equipment cost is reduced, any position