Glue sealing process for mini LED (Light Emitting Diode)

• Main Authors: CHEN YONGMING, ZHANG YUAN, MA FEIFEI, DUAN JINFU, SANG JIAN
• Format: Patent
• Language: Chinese; English
• Published: 08.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a mini LED glue sealing process. The mini LED glue sealing process is characterized by comprising the specific steps that (1) a substrate is placed on a glue dispensing platform; setting (0, 0) coordinate points according to the substrate, and welding the LED chip on the subst...