Glue sealing process for mini LED (Light Emitting Diode)

• Main Authors: CHEN YONGMING, ZHANG YUAN, MA FEIFEI, DUAN JINFU, SANG JIAN
• Format: Patent
• Language: Chinese; English
• Published: 08.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a mini LED glue sealing process. The mini LED glue sealing process is characterized by comprising the specific steps that (1) a substrate is placed on a glue dispensing platform; setting (0, 0) coordinate points according to the substrate, and welding the LED chip on the substrate; (2) dispensing a transparent adhesive tape on the LED chip by adopting a dispensing machine; (3) spraying out the transparent adhesive tape through a spray valve of the dispensing machine; (4) after the glue dispenser finishes covering all positions of the substrate with the transparent glue, the glue dispenser returns to the (0, 0) coordinate point, and the step (3) is repeated for spraying of the next layer; (5) in the spraying process, the transparent adhesive floats down to the substrate in the form of vaporific colloid; and (6) the vaporous transparent adhesive is naturally precipitated and cured on the substrate and the LED chip to form a transparent adhesive layer, so that the LED lamp panel is obtaine