3D interposer with through glass vias-methods of increasing adhesion between copper and glass surfaces and articles thereof

• Main Authors: KIM JIN-SU, LEVESQUE DANIEL WAYNE JR, LI AIZE, VANSLEIJS HENDRIK NICOLAAS
• Format: Patent
• Language: Chinese; English
• Published: 04.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

In some embodiments, a method includes forming a guide hole or damage trajectory through a laminated glass structure using a laser. The laminated glass structure includes a first layer and a second layer adjacent to the first layer. The first layer is formed from a first glass composition. The second layer is formed of a second glass composition different from the first glass composition. After forming the via hole, the laminated glass structure is exposed to etching conditions that etch the first glass composition at a first etch rate and etch the second glass composition at a second etch rate to form an etched hole, where the first etch rate is different than the second etch rate. 在一些实施方式中，一种方法包括使用激光形成穿过层压玻璃结构的导孔或损伤轨迹。该层压玻璃结构包括第一层和与第一层相邻的第二层。第一层由第一玻璃组合物形成。第二层由不同于第一玻璃组合物的第二玻璃组合物形成。在形成导孔之后，将层压玻璃结构暴露于以第一蚀刻速率蚀刻第一玻璃组合物和以第二蚀刻速率蚀刻第二玻璃组合物的蚀刻条件，以形成蚀刻孔，其中第一蚀刻速率不同于第二蚀刻速率。