Circuit board line signal enhancement method and structure thereof

The invention provides a circuit board line signal strengthening method and a structure thereof. The method comprises the following steps of: respectively forming a first substrate body with a first signal transmission line layer and a second substrate body with a second signal transmission line lay...

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Bibliographic Details
Main Authors LIN YOUCHENG, WANG ZIXUAN
Format Patent
LanguageChinese
English
Published 04.08.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The invention provides a circuit board line signal strengthening method and a structure thereof. The method comprises the following steps of: respectively forming a first substrate body with a first signal transmission line layer and a second substrate body with a second signal transmission line layer on the upper surface and the lower surface of a core layer; forming a first line signal strengthening layer and a second line signal strengthening layer on the first substrate body and the second substrate body respectively; respectively forming a third substrate body with a third signal transmission line layer and a fourth substrate body with a fourth signal transmission line layer on the bearing substrate; separating the third substrate body and the fourth substrate body by the bearing substrate; the first signal transmission line layer and the third signal transmission line layer are combined through the first line signal strengthening layer, and the second signal transmission line layer and the fourth signal
Bibliography:Application Number: CN202210084919