Semiconductor device production sampling inspection grabbing mechanism

• Main Author: CHEN BINGGUI
• Format: Patent
• Language: Chinese; English
• Published: 04.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a sampling detection grabbing mechanism for semiconductor device production, and relates to the technical field of semiconductor device production. The semiconductor device production sampling inspection grabbing mechanism comprises a conveying assembly and an inspection table, a mounting column is mounted on the outer wall of one side of the conveying assembly, a placing table is mounted at the top of the mounting column, a control panel is mounted on the outer wall of one side of the inspection table, a stabilizing assembly is arranged in the placing table, and a clamping assembly is arranged in the stabilizing assembly. A grabbing assembly is arranged above the placing table, and the grabbing assembly is used for grabbing a wafer to be detected; the grabbing assembly comprises a second fixing plate, a suction cup, an air pipe, an air pump and an extrusion rod, the top of the suction cup is installed at the bottom of the second fixing plate through a second supporting rod, the grabbi