Neutral anti-oxidation polishing solution suitable for copper material and preparation method of neutral anti-oxidation polishing solution

• Main Authors: ZHANG WENJING, GUO DAN, AI TIANCHENG, ZHANG XIN, PHUA KOK SOON
• Format: Patent
• Language: Chinese; English
• Published: 04.08.2023
• Subjects: ADHESIVES; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; DYES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25; NATURAL RESINS; NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; PAINTS; POLISHES; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES

The invention discloses a neutral antioxidant polishing solution suitable for a copper material and a preparation method thereof, the pH value of the polishing solution is 6.5-7.5, and the polishing solution comprises alkaline lignin, an oxidant, abrasive particles, a pH regulator and a carrier. The polishing solution is simple in component, free of toxic and harmful elements, environmentally friendly, small in corrosion damage to equipment and high in polishing removal efficiency, copper materials can maintain low oxygen content and good oxidation resistance in the polishing process, and the copper materials have low surface roughness after being polished. 本发明公开了适用于铜材料的中性抗氧化抛光液及其制备方法，该抛光液的pH值为6.5～7.5，包括：碱性木质素、氧化剂、磨粒、pH调节剂和载体。该抛光液不仅组分简单、不含有毒有害元素、对环境友好、对设备腐蚀破坏性小、具有较高的抛光去除效率，而且可以使得铜材料在抛光过程中维持较低的含氧量和较好的抗氧化性能、抛光后具有较低的表面粗糙度。