Curable resin film, composite sheet, semiconductor chip, and method for producing semiconductor chip
The present invention provides a curable resin film for forming a cured resin film as a protective film on both a bump-forming surface and a side surface of a semiconductor chip having the bump-forming surface provided with bumps, the curable resin film having an elongation at break of 85% or less a...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
01.08.2023
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Subjects | |
Online Access | Get full text |
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