Curable resin film, composite sheet, semiconductor chip, and method for producing semiconductor chip

• Main Author: KAINUMA RENA
• Format: Patent
• Language: Chinese; English
• Published: 01.08.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The present invention provides a curable resin film for forming a cured resin film as a protective film on both a bump-forming surface and a side surface of a semiconductor chip having the bump-forming surface provided with bumps, the curable resin film having an elongation at break of 85% or less at 70 DEG C after curing. 本发明提供一种固化性树脂膜，其用于在具有具备凸块的凸块形成面的半导体芯片的上述凸块形成面及侧面这两者形成作为保护膜的固化树脂膜，其中，上述固化性树脂膜在固化后于70℃下的断裂伸长率为85％以下。