Method for 3D additive manufacturing of electronic and photoelectric devices

• Main Authors: NIU CHONGSHI, LIN HE, WANG YAOLIN, HONG XUETIAN
• Format: Patent
• Language: Chinese; English
• Published: 01.08.2023
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention provides a method for 3D additive manufacturing of electronic and photoelectric devices. The method comprises the steps that a 3D additive manufacturing intelligent integrated platform is built; a design group, a 3D additive intelligent manufacturing group, a 3D additive manufacturing multifunctional detection group, a multi-type integrated packaging group and a local cloud data sharing group are integrated; 3D additive manufacturing overall process design of semiconductor electronic and photoelectric devices is carried out through the integrated design group; a 3D additive manufacturing detailed process is generated through the 3D additive intelligent manufacturing group, and 3D additive intelligent manufacturing of semiconductor electronic and photoelectric devices is carried out; 3D additive manufacturing real-time detection and 3D additive manufacturing final detection testing are carried out through the 3D additive manufacturing multifunctional detection set; electrical connection and packa