Wafer cleaning device, chemical mechanical grinding machine and cleaning method

• Main Authors: SUN YANSONG, LI CHAOYONG, CHEN ZHI, QI BAOYU, SONG KAIXING, CHEN KUN, HUANG YAODONG
• Format: Patent
• Language: Chinese; English
• Published: 01.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CLEANING; CLEANING IN GENERAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; SEMICONDUCTOR DEVICES; TRANSPORTING

The invention discloses a wafer cleaning device, a chemical mechanical grinding machine and a cleaning method. The wafer cleaning device comprises a rolling brush which comprises a body, a first protrusion and a second protrusion, wherein the first protrusion and the second protrusion are arranged on the surface of the body; a rolling brush driving device; the rolling brush driving device is used for driving the rolling brush to rotate around the central axis of the rolling brush. Wherein the first bulge is a cylindrical bulge; the second bulge is a needle-shaped bulge; a wafer can be arranged between the two rolling brushes, and the surface of the wafer makes contact with the cylindrical protrusions and the needle-shaped protrusions. According to the embodiment of the invention, the plurality of needle-shaped bulge structures are arranged at the gaps of the cylindrical bulges, so that the contact area between the whole rolling brush and the surface of the wafer is increased, and the utilization rate of the c