Liquid helium double-medium compatible heat sink device

• Main Authors: SU YULEI, ZHANG HUABIAO, QIU YINAN, JIA YIQING, ZHOU JIAYI
• Format: Patent
• Language: Chinese; English
• Published: 25.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CLEANING; CLEANING IN GENERAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; SEMICONDUCTOR DEVICES; TRANSPORTING

The invention discloses a liquid-helium double-medium compatible heat sink device which structurally comprises a heat dissipation fan, a heat sink plate and a liquid nitrogen pipe, the back face of the heat dissipation fan is mechanically connected with the front face of the heat sink plate, a contact base makes contact with the surface of a chip to concentrate heat, the heat is output to a back plate through the efficient heat pipe, and the heat dissipation efficiency is improved. A large part of heat is output to the heat dissipation fins through the back plate, meanwhile, rapid heat dissipation is conducted through double media of the liquid nitrogen pipe and the heat dissipation fan, after the heat dissipation fan blows air into the heat dissipation block, airflow can rapidly impact the heat dissipation fins, the contact area with the air is greatly increased through the heat dissipation grooves, the heat dissipation effect is better, and the heat dissipation efficiency is improved. Meanwhile, a part of a