Electronic detonator module sealing and molding mold structure and sealing and molding system comprising same

• Main Authors: ZHU YU, SUN ZHU, LUO XIANHONG, YANG ANKE
• Format: Patent
• Language: Chinese; English
• Published: 25.07.2023
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention discloses an electronic detonator module glue sealing and molding mold structure and a glue sealing and molding system comprising the same, and belongs to the technical field of electronic detonators. The electronic detonator module sealing glue molding mold structure comprises a first module, a second module and a third module, wherein a first space constraint structure is arranged on the first module; the second module is provided with a second spatial constraint structure; pouring gate structures are arranged on the first module and the second module; when the first module and the second module are closed, a containing cavity capable of containing the base plate and a plurality of cavities to be injected with glue are defined between the first space constraint structure and the second space constraint structure, and after the base plate is placed in the containing cavity, the parts to be sealed with glue of the electronic detonator module are located in the cavities to be injected with glue r