Semiconductor packaging structure with temperature equalizing function and packaging method thereof

• Main Authors: CHEN FAJUN, YAN ZHIYANG, PANG LONGJI, YUAN XUEPENG, TANG YONG, YAO JIANFENG, CHEN YIXI
• Format: Patent
• Language: Chinese; English
• Published: 21.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a semiconductor structure with a temperature equalizing function and a packaging method. The semiconductor structure comprises a molding compound wrapping layer, a frame base island, frame pins, metal leads and chips, the frame base island consists of an upper shell plate, a lower shell plate, a liquid absorption core and a powder column; the chip is welded on the frame base island and is connected with the frame pin through a metal lead; the frame base island is wholly wrapped in the plastic package material wrapping layer, and the bottom surface of the frame base island and the frame pins are exposed out of the plastic package material wrapping layer; a micro groove is formed in the upper surface of the molding compound wrapping layer; and the upper shell plate, the lower shell plate, the liquid absorption core and the powder column are prepared by adopting a uniform temperature plate. By adopting the uniform-temperature plate and the high-thermal-conductivity filler, the thermal cond