Chip packaging structure for improving heat dissipation and preparation method thereof

• Main Authors: SU YUYAN, CHEN YIGAO, TANG DENGFENG, ZHANG LINGYAN
• Format: Patent
• Language: Chinese; English
• Published: 21.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a chip packaging structure capable of improving heat dissipation and a preparation method thereof, and relates to the technical field of semiconductor packaging, the chip packaging structure comprises a substrate and a chip, the chip is electrically connected with the top wall of the substrate, and the chip is electrically connected with the top wall of the substrate. The first heat dissipation assembly is arranged on the top wall of the chip, the second heat dissipation assembly is arranged on the side wall of the chip, the main liquid inlet pipe is used for supplying cooling liquid to the first heat dissipation assembly and the second heat dissipation assembly, and the packaging layer is used for wrapping the chip. The method has the effect of improving the heat dissipation effect of the chip. 本申请涉及一种改善散热的芯片封装结构及其制备方法，其涉及半导体封装技术领域，其包括基板和芯片，所述芯片和所述基板的顶壁电连接，还包括设置在所述芯片顶壁的第一散热组件、设置在所述芯片侧壁的第二散热组件、总进液管以及包封层，所述总进液管用于对所述第一散热组件和所述第二散热组件供给冷却液，所述包封层用于包裹所述芯片。本申请具有改善芯片的散热效果的效果。