Silver-copper alloy bonding wire and preparation method thereof

• Main Authors: MA LONGKE, SU FENGLING, LIANG SHUANG, HUANG FUXIANG
• Format: Patent
• Language: Chinese; English
• Published: 21.07.2023
• Subjects: ALLOYS; APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CHEMISTRY; FERROUS OR NON-FERROUS ALLOYS; METALLURGY; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS

The invention discloses a silver-copper alloy bonding wire and a preparation method thereof, and belongs to the technical field of bonding wire materials for packaging integrated circuits (IC) and light-emitting diode (LED) devices, and the silver-copper alloy bonding wire containing 0.4 wt%-0.9 wt% of Cu, 0.001 wt%-0.005 wt% of Au, 0.001 wt%-0.005 wt% of Pd, 0.001 wt%-0.005 wt% of Sn, 0.001 wt%-0.005 wt% of In, 0.0001 wt%-0.002 wt% of Ce, 99.9 wt%-99.9999 wt% of silver and impurities is prepared through the preparation method of the silver-copper alloy bonding wire. The bonding wire is not easy to break, and the vulcanization performance of the bonding wire is improved. 一种银铜合金键合丝及其制备方法，属于集成电路IC及LED器件封装用键合丝材料技术领域，通过银铜合金键合丝制备方法制备了一种内含0.4wt~0.9wt%的Cu、0.001wt%~0.005wt%的Au、0.001wt%~0.005wt%的Pd、0.001wt%~0.005wt%的Sn、0.001wt%~0.005wt%的In、0.0001wt%~0.002wt%的Ce和99.9wt%~99.9999wt%银、及杂质的银铜合金键合丝。该键合丝不容易断丝，且提升了键合丝的硫化性能。