Wafer clamping device

• Main Authors: TIAN WENKANG, WANG ZHAOFENG, FAN XIONG
• Format: Patent
• Language: Chinese; English
• Published: 18.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a wafer clamping device which comprises a tray, a rotary limiting block and at least two fixed limiting assemblies, one fixed limiting assembly comprises two fixed limiting blocks, the fixed limiting blocks are provided with supporting grooves, and the rotary limiting block is provided with a supporting table; the fixed limiting block can be used as a clamping reference, so that the wafer can be clamped at a preset position; the rotary limiting block can change the distance between the rotary limiting block and the fixed limiting assembly through rotation, so that the three limiting blocks can clamp wafers of different specifications; the wafer is supported through cooperation of the supporting groove and the supporting table, the wafer can be lifted by the three limiting blocks, and therefore the back face of the wafer is prevented from being damaged; by additionally arranging the fixing and limiting assembly, the clamping device can clamp wafers of more specifications; according to t