Wafer, control chip processing method and solid state disk control method

• Main Authors: ZHOU MINGYU, TENG XIANGYANG
• Format: Patent
• Language: Chinese; English
• Published: 18.07.2023
• Subjects: CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; PHYSICS

In the invention, a wafer, a control chip processing method and a solid state disk control method are provided, and one or more chip units are arranged on the wafer; wherein each chip unit is provided with a host interface and a storage medium interface, so that data transmission is carried out through the host interface and the storage medium interface; a high-speed chip interconnection bus is also arranged on the wafer, and the high-speed chip interconnection bus penetrates through each chip unit to connect modules in each chip unit; each chip unit is provided with a chip address module, and different chip addresses and functions are set for the chip units through the chip address modules, so that resources of the chip units are integrated into a chip with higher performance. Therefore, according to various performance requirements of solid state disk products, chips of the chip units with the number matched with that of the chips can be cut from the wafer and packaged, and flexible and diversified control