Transfer machine, cleaning assembly, and substrate processing apparatus

• Main Authors: KOBAYASHI KENICHI, SAITO AYUMI, MIYAZAWA YASUYUKI, SOMA TAKESHI, MATSUGI ASAKI, AOYAMA EIJI, YAZAWA AKIHIRO, SASAYA YUSUKE, FURUSAWA MANATO, NOJO KEIICHI
• Format: Patent
• Language: Chinese; English
• Published: 14.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Provided are a cleaning module and a substrate processing apparatus capable of improving the cleaning power of a substrate with a simple structure. The cleaning unit includes: a first conveyance mechanism (210-1) for conveying the substrate (WF) in a state where the surface to be polished faces downward to a substrate transfer position (418) on the downstream side along a conveyance path (405); an ultrasonic cleaning tank (440) that is disposed at a position away from the conveyance path (405) and that cleans the substrate (WF) in a state in which the surface to be polished faces downward; a transfer machine (420) for transferring the substrate (WF) between a substrate transfer position (418) of the conveyance path (405) and the ultrasonic cleaning tank (440); and a second conveyance mechanism (210-2) for further conveying the substrate (WF), which has been transferred from the ultrasonic cleaning tank (440) to the substrate transfer position (418) by the transfer machine (420), to the downstream side along t