Six-inch wafer splitting machine and splitting method

• Main Authors: GU CHAOWEN, CHE XINLU, ZHANG YITUN, HAN KAIYIN, MA XIUYUAN, HU YIDING
• Format: Patent
• Language: Chinese; English
• Published: 14.07.2023
• Subjects: PERFORMING OPERATIONS; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

The invention provides a six-inch wafer splitting machine and method, and belongs to the technical field of wafer splitting. The six-inch wafer splitting machine comprises a machine body and a workbench; the machine body is further provided with a tool bit device, a visual positioning device, a visual recognition device, a first driving device and a second driving device. The tool bit device comprises a chopper suitable for splitting a wafer; the visual positioning device is suitable for adjusting the angle and the position of the wafer on the workbench; the visual identification device is suitable for identifying an image of a to-be-split area on the wafer; the tool bit device is installed at the driving end of the second driving device. According to the wafer splitting machine provided by the invention, the workbench is arranged on the machine body, the wafer is placed on the workbench, the position of the wafer is adjusted through the visual positioning device, the image of the to-be-split area on the wafe