Chip package and method of forming same

• Main Authors: ZHANG HAOJIAN, XIE ZHENGLIN, LIAOJINJI, DARRYWAY VAUGHAN KEN
• Format: Patent
• Language: Chinese; English
• Published: 11.07.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A chip package and a method of forming a chip package are provided. The chip package includes: a chip having at least one contact pad; a contact structure formed from at least one continuously longitudinally extending conductive element by attaching the at least one conductive element to the contact pad at at least three contact locations wherein the at least one conductive element is bent away from the contact pad between pairs of consecutive contact locations; and an encapsulation partially encapsulating the contact structure, where the encapsulation includes an outer surface facing away from the chip, and where the contact structure is partially exposed at the outer surface. 本发明提供了一种芯片封装和一种形成芯片封装的方法。该芯片封装包括：芯片，该芯片具有至少一个接触垫；接触结构，该接触结构由至少一个连续纵向延伸的导电元件通过在至少三个接触位置将所述至少一个导电元件附接至接触垫而形成，其中，所述至少一个导电元件在成对的连贯接触位置之间弯曲远离接触垫；以及包封件，该包封件部分地包封接触结构，其中，包封件包括背离芯片的外表面，并且其中，接触结构部分地暴露在外表面。