Micro-electro-mechanical sensing device and sensing module thereof

• Main Authors: CHEN MINGFA, GUO PEIQI, LI BAIXUN
• Format: Patent
• Language: Chinese; English
• Published: 11.07.2023
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PHYSICS; TESTING; TRANSPORTING

The invention discloses a micro-electro-mechanical sensing device and a sensing module thereof. The micro-electro-mechanical sensing device comprises a substrate, a heater and a sensing electrode. The heater is arranged on the substrate and is provided with a heating working part; the sensing electrode has a sensing working portion. The heater and the sensing electrode are arranged on different layers in the stacking direction, and the sensing electrode is electrically insulated from the heater. On a reference plane in the stacking direction, the projection of the heating working part of the heater covers the projection of the sensing working part of the sensing electrode. 本发明公开一种微机电感测装置及其感测模块，其中该微机电感测装置包含基底、加热器以及感测电极。加热器设置于基底上，且加热器具有加热工作部分。感测电极具有感测工作部分。加热器和感测电极沿堆叠方向设置于不同层，且感测电极与加热器电性绝缘。在堆叠方向的参考面上，加热器的加热工作部分的投影覆盖感测电极的感测工作部分的投影。