High-temperature-stripping-resistant CPP film and aluminum-plastic film bonding preparation process

• Main Author: SUN YUNCHANG
• Format: Patent
• Language: Chinese; English
• Published: 11.07.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

The invention relates to a high-temperature-stripping-resistant CPP film and aluminum-plastic film bonding preparation technology. The technology comprises the following steps that A, an inner-layer adhesive is placed in a solvent to be mixed till the inner-layer adhesive is completely dissolved; b, screening and filtering the solution in the step A to remove residues; c, coating the corona layer surface of the CPP film with the solution obtained in the step B, and volatilizing the solvent through a drying oven; d, hot-pressing and compounding the CPP film obtained in the step C and an aluminum foil; and E, heating the composite aluminum foil obtained in the step D through a drying tunnel or a heating roller, carrying out shock cooling on an outlet position by using a cold roller, cooling to room temperature, rolling, and carrying out high-temperature curing. According to the invention, the CPP film with a new-formula corona layer and the preferable adhesive are adopted, and a more accurate hot-pressing compo