Punching method of inner layer etching alignment punching machine

• Main Authors: WANG XIAOWEI, ZHAO GANGHUI, CHEN DONGGUI, DENG XIUWEI, CHENG ZHIFENG
• Format: Patent
• Language: Chinese; English
• Published: 04.07.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention discloses a punching method of an inner layer etching alignment punching machine, and belongs to the technical field of printed circuit board processing. The punching method of the inner layer etching alignment punching machine comprises the steps that a circuit board is placed on an alignment workbench, and a photoelectric detection device detects the thickness of the circuit board and feeds back the thickness information of the circuit board to a controller; the alignment device operates with a driving motor on the alignment workbench to adjust the position of the circuit board, so that the circuit board is aligned with the view center of the visual inspection device; a circuit board is conveyed into a punching workbench through a conveying device, a visual detection device recognizes a target of the circuit board, and position coordinate information of the target is fed back to a controller; the controller adjusts the position of the upper punching die according to the position coordinate inf