Curable resin composition and dry film

• Main Authors: TOKUMITSU KAYOKO, KANEKO TAKESHI, TAKII YOJI, KURITA MASATOSHI, MATSUO AKIHIKO
• Format: Patent
• Language: Chinese; English
• Published: 30.06.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention addresses the problem of providing a curable resin composition which has excellent cleaning removability even when the curable resin composition is attached to a matching tank or equipment used in a solder resist ink manufacturing process and dried. A curable resin composition according to a solution of the present invention contains (A) a curable resin, (B) a filler, and (C) an organic solvent. The dissolution start time in propylene glycol monomethyl ether acetate, which is a cleaning solvent, of a fully dried coating film having a length of 20 mm * a width of 20 mm * a film thickness of 7 [mu] m formed using the curable resin composition is within 20 seconds from the start of immersion in the cleaning solvent. 本发明的课题是提供一种固化性树脂组合物，即使在附着于阻焊油墨的制造过程中使用的配合桶或设备并干燥的情况下，清洗除去性也优异。本发明的解决方案的固化性树脂组合物是含有(A)固化性树脂、(B)填料和(C)有机溶剂的固化性树脂组合物，其特征在于，使用所述固化性树脂组合物形成的纵20mm×横20mm×膜厚7μm的完全干燥涂膜的在作为清洗溶剂的丙二醇单甲醚乙酸酯中的溶解开始时间，是在从在所述清洗溶剂中浸渍开始的20秒钟以内。