Anti-layering lead frame

• Main Authors: MA CHUNHUI, XU WENDONG, ZHU BAOCAI
• Format: Patent
• Language: Chinese; English
• Published: 30.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses an anti-layering lead frame, and relates to the technical field of integrated circuits, the anti-layering lead frame is formed by arranging a plurality of lead frame units in sequence, and any two adjacent lead frame units are connected through a connecting piece; the lead frame unit comprises a chip carrier, a first pin and a second pin, the first pin and the second pin are arranged on the connecting piece, and one end of the first pin is connected with the chip carrier. According to the invention, the design is novel, through the arrangement of the connecting piece, the connecting piece comprises the connecting rib and the connecting strip, the chip carrier is connected to the connecting rib, the connecting rib is provided with the heat dissipation holes, and the heat dissipation holes are convenient for heat dissipation treatment in the later plastic packaging process; the first pin and the second pin are both connected to the connecting strip, and the connecting strip is provided w