Film pasting device

• Main Authors: SHI WEN, XU SHUANGSHUANG, ZHANG MINGMING, WU HONGBAI, YU HUPING, NIU ZILE
• Format: Patent
• Language: Chinese; English
• Published: 30.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a film pasting device, and relates to the technical field of wafer film pasting. According to the film pasting device, the film supplying mechanism is used for conveying the film to the film pasting mechanism which is arranged at the interval from the film supplying mechanism, in the process, the film is conveyed between the film supplying mechanism and the film pasting mechanism along the preset conveying path, and when the movable part applies force to the containing component of the film supplying mechanism, after rotation of the containing component is stopped, the film is conveyed to the film pasting mechanism. The storage component is locked and does not continue to convey the film, the length of the film extending along the conveying path between the film supply mechanism and the film pasting mechanism is fixed, on the basis, the tensioning component is used for applying force to the film, so that the length of the conveying path of the film is increased, the film is tensioned un