SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

• Main Authors: PARK WANJAE, JU YOON-JONG, OH DONG-SUB, HAN MIN-SUNG, LEE SUNG-KIL, NOH MYEONG-SUP, UM YOUNGJE
• Format: Patent
• Language: Chinese; English
• Published: 30.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An exemplary embodiment of the invention provides a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes: a chamber having an internal space; a shower head for dividing the internal space into an upper first region and a lower second region, and having a plurality of through-holes formed therein; a support unit for supporting the substrate in the second region; a gas supply unit for supplying a gas to the first region; a plasma source for forming a plasma in the first region by exciting a gas; and an adsorption plate coupled to the shower head, wherein a surface of the adsorption plate is provided with a material that adsorbs groups contained in the plasma. 本发明的示例性实施方案提供了一种基板处理装置及基板处理方法。该基材处理装置包括：具有内部空间的腔室；喷淋头，该喷淋头用于将内部空间划分为上部第一区域和下部第二区域、并形成有多个贯通孔；用于在第二区域中支承基板的支承单元；用于向第一区域供应气体的气体供应单元；用于通过激发气体而在第一区域中形成等离子体的等离子体源；以及联接至喷淋头的吸附板，其中所述吸附板的表面设置有吸附等离子体中包含的基团的材料。