High-temperature optical fiber F-P cavity MEMS sensor with stress isolation structure and manufacturing method thereof

• Main Authors: ZI GUOHAO, REN SEN, LI XIAOHAN, MA ZHIBO
• Format: Patent
• Language: Chinese; English
• Published: 30.06.2023
• Subjects: ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS; MEASURING; MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PHYSICS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TARIFF METERING APPARATUS; TESTING; TRANSPORTING

The invention relates to a high-temperature optical fiber F-P cavity MEMS sensor with a stress isolation structure and a manufacturing method of the high-temperature optical fiber F-P cavity MEMS sensor. In an existing adhesive packaging structure, large packaging stress can be introduced in practical application due to the existence of an adhesive, so that the performance of a sensor is reduced. The invention provides a high-temperature optical fiber F-P cavity MEMS sensor with a stress isolation structure, which comprises a sensitive diaphragm layer, a middle layer and a substrate layer which are sequentially bonded, an F-P air cavity is etched on the middle layer on the upper surface of the substrate layer, a supporting sleeve is arranged on the lower surface of the substrate layer, the stress isolation structure is arranged on the periphery of the lower end of the substrate layer, and the stress isolation structure is arranged on the periphery of the lower end of the substrate layer. The stress isolation