Chemical mechanical polishing solution

• Main Authors: DONG ZETONG, TAN MINGYUE, SUN CHENMIN, ZHU WEIHAN, SUN JINTAO, WANG CHEN, WANG SONG, GU QINYUAN
• Format: Patent
• Language: Chinese; English
• Published: 30.06.2023
• Subjects: ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; POLISHES; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES

The invention provides a chemical mechanical polishing solution. The chemical mechanical polishing solution comprises alpha-aluminum oxide nano grinding particles treated by a nonionic surfactant, an oxidizing agent, organic carboxylic acid, water and a pH regulator. The chemical mechanical polishing solution is a method for modifying abrasive particles with positive electric surfaces by using a nonionic surfactant. The obtained nanoparticles can keep stable for a long time in an organic acid solution environment, and have good polishing performance. 本发明提供一种化学机械抛光液，包括经非离子表面活性剂处理后的α-氧化铝纳米研磨颗粒、氧化剂、有机羧酸、水和pH调节剂。本发明的化学机械抛光液使用非离子型表面活性剂来修饰具有正电表面的磨料颗粒的方法。所得纳米颗粒在有机酸的溶液环境下能保持长时间稳定，并具有良好的抛光性能。