PCB multilayer board drilling communication method and device

• Main Authors: ZHANG SILEI, LIU WENHONG, YANG JUN-HO, ZHAN YOUGEN
• Format: Patent
• Language: Chinese; English
• Published: 27.06.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention belongs to the field of PCB manufacturing, and particularly relates to a PCB multilayer board drilling communication method and equipment, firstly, in the PCB production process, a circular protrusion A and a circular protrusion B corresponding to corresponding guide holes in a PCB are formed on a circuit copper layer A and a circuit copper layer B in the PCB respectively, the diameter of the circular protrusion B is larger than that of the circular protrusion A, and the circular protrusion B and the circular protrusion A are coaxial; the process of conducting the circuit copper layer A and the circuit copper layer A is realized in a physical mode instead of a chemical mode of copper deposition on the inner wall of a guide hole in the PCB and full-board electroplating, and the whole technological process is environment-friendly and low in cost. 本发明属于PCB制造领域，尤其涉及一种PCB多层板件钻孔连通方法及设备，首先，在PCB生产过程中，在PCB内的线路铜层A和线路铜层B上分别成型与PCB上相应导孔对应的圆凸A和圆凸B，圆凸B的直径大于圆凸A的直径且两者同轴线。导通线路铜层A与线路铜层A的过程是采用物理方式来实现的，而非采用对PCB上导孔内壁