Packaging method of photon detector and photon detector

• Main Authors: XIAO HAOYANG, YANG RIGUI, SONG GUANQIANG, YU GONGCHI, XIONG YANCHUN, LI YUHONG
• Format: Patent
• Language: Chinese; English
• Published: 27.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a packaging method of a photon detector and the photon detector, and the method comprises the steps: providing a substrate and a chip, enabling one side of the substrate to be provided with a first conductive layer, and enabling the other side of the substrate to be provided with a second conductive layer; etching the first conductive layer to form a first conductive circuit on the first conductive layer; mounting a chip on the first conductive layer so that the chip is electrically connected with the first conductive circuit; sequentially laminating a first dielectric layer and a third conductive layer on the outer surface of the chip; performing etching treatment and electroplating treatment on the second conductive layer and the third conductive layer to form a second conductive circuit on the second conductive layer and form a third conductive circuit on the third conductive layer; and installing a photoelectric conversion crystal on the third conductive layer, so that the photoele