Thick film circuit module for well logging and manufacturing method thereof

The invention provides a thick film circuit module for well logging and a manufacturing method thereof, and the manufacturing method comprises the steps: providing an upper tube shell with a phase change cavity and a lower tube shell with a vacuum cavity, and enabling a bare chip to be arranged in t...

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Main Authors FAN LIN, ZHANG JUNYONG, QIAN DELONG, GE HAIYA, PANG PENGFEI, NIU BEN, YANG ZUOXIN, CHEN JIANHUA, WU LING, WEI BAOJUN, FENG YINGZHUO, LEE SUNG KYUN, HUANG MINGYAN, LI GUOWEI, ZHOU QIANG, WANG YI'AN, HU YU, ZHANG HONGJIE, CHEN SHUMENG, LI HUAFENG
Format Patent
LanguageChinese
English
Published 27.06.2023
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Summary:The invention provides a thick film circuit module for well logging and a manufacturing method thereof, and the manufacturing method comprises the steps: providing an upper tube shell with a phase change cavity and a lower tube shell with a vacuum cavity, and enabling a bare chip to be arranged in the vacuum cavity; carrying out vacuumizing treatment on the vacuum cavity in a vacuum environment; after the upper tube shell is heated to a set temperature, the liquefied phase change material is poured into a phase change cavity of the upper tube shell; after the upper tube shell is cooled, the upper tube shell and the lower tube shell are connected in a sealed mode. The temperature resistance of the logging instrument is improved. 本发明提供了一种测井用厚膜电路模块及其制作方法,所述制作方法包括,提供具有相变腔体的上管壳以及具有真空腔体的下管壳,其中,真空腔体内设有裸芯片;在真空环境下,对真空腔体进行抽真空处理;将上管壳进行加热至设定温度后,将液化的相变材料灌注入上管壳的相变腔体中;在上管壳冷却完毕后,将上管壳与下管壳之间密封连接。本发明提高了测井仪器的耐温性能。
Bibliography:Application Number: CN202111601011