Bonding method and bonding apparatus

• Main Authors: TASHIRO KEI, IINO KATSUHIRO
• Format: Patent
• Language: Chinese; English
• Published: 27.06.2023
• Subjects: LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; TRANSPORTING

The invention provides a bonding method and a bonding apparatus, which can control warping of a superposed substrate formed by bonding a first substrate and a second substrate. The bonding method includes: using a first holding portion to absorb and hold a first substrate; absorbing and holding the second substrate by using a second holding part; and forming a superposed substrate by bringing the first substrate into contact with the second substrate by relatively moving the first holding portion and the second holding portion. The bonding method according to one embodiment of the present invention further comprises: heating the first substrate and the second substrate, or the superimposed substrate; and cooling the heated superposed substrate by using a cooling part. In addition, during cooling, warpage of the superposed substrate is controlled by forming a temperature difference in the superposed substrate. 本发明提供一种接合方法和接合装置，能够控制将第一基板与第二基板接合而成的重合基板的翘曲。本发明的接合方法包括：使用第一保持部来吸附并保持第一基板；使用第二保持部来吸附并保持第二基板；以及通过使第一保持部