Polyamide resin composition

• Main Authors: WADA SHUSAKU, AJISAKA YUNA, HIGASHIYAMA KOJI
• Format: Patent
• Language: Chinese; English
• Published: 23.06.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP

Provided is a polyamide resin composition with which it is possible to obtain a molded article that is tough and flexible and has excellent impact resistance. The polyamide resin composition comprises 15-35% by mass of a polyamide elastomer (A), 40-79% by mass of an aliphatic polyamide resin (B) having more than 6 carbon atoms per one amide group per 100% by mass of the polyamide resin composition, and 0.1-35% by mass of an aromatic polyamide resin (C), and 0-10 mass% of an aliphatic polyamide resin (D) having an average number of carbon atoms of 6 or less per one amide group. 提供一种聚酰胺树脂组合物，其能够得到强韧且具有柔软性、耐冲击性优异的成形品。本发明的聚酰胺树脂组合物在聚酰胺树脂组合物100质量％中包含：聚酰胺系弹性体(A)15～35质量％、相对于1个酰胺基的平均碳原子数超过6的脂肪族聚酰胺树脂(B)40～79质量％、芳香族聚酰胺树脂(C)0.1～35质量％、以及相对于1个酰胺基的平均碳原子数为6以下的脂肪族聚酰胺树脂(D)0～10质量％。