Semiconductor package structure including heat sink and method of manufacturing same

• Main Authors: LIU XINGBO, SHI JINYUAN, SONG BO, XU WEIGUO, ZENG JIN
• Format: Patent
• Language: Chinese; English
• Published: 23.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a semiconductor packaging structure comprising a radiator and a manufacturing method thereof, the semiconductor packaging structure comprises a substrate, a conductive component, a plurality of chips and a radiating shell, the conductive component is fixed on the surface of the substrate, the conductive component is a polyhedron, the conductive component is provided with a circuit layer electrically connected with the substrate, and the plurality of chips are arranged on the substrate. Each surface of the conductive assembly is provided with a connecting point electrically connected with the circuit layer, the functional surfaces of the chips are in one-to-one correspondence with the surfaces of the conductive assembly and are electrically connected with the connecting points, and the circuit layer is used for electrically connecting the substrate and the chips; the heat dissipation shell is of a cylindrical structure with one end open, the open end of the heat dissipation shell is fi