METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

• Main Authors: HAN KYU-BIN, OH HEUNG-SUK, KIM SANG-WOOK
• Format: Patent
• Language: Chinese; English
• Published: 23.06.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES

A method of manufacturing a semiconductor device using a curvilinear optical proximity correction (OPC) method is provided. The method of manufacturing a semiconductor device includes: performing an OPC step on a layout to generate a correction pattern, the correction pattern having a curved shape;...