High-heat-resistance conductive silver adhesive based on ceramic precursor and preparation method of high-heat-resistance conductive silver adhesive

• Main Authors: PHAN QUANG, ZOU JIAJIA, CHEN FANG, WANG DAOCHANG, LIANG RUILI, HUANG MENGQIU, LI LEI, ZHANG JING
• Format: Patent
• Language: Chinese; English
• Published: 23.06.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

The invention relates to the technical field of conductive material preparation, in particular to a high-heat-resistance conductive silver adhesive based on a ceramic precursor and a preparation method thereof.The conductive silver adhesive comprises 45-70 wt% of a resin matrix and 30-55 wt% of conductive filler and is specifically prepared from, by weight, 100 parts of the ceramic precursor and modified epoxy resin of the ceramic precursor, 10-20 parts of a curing agent and 10-20 parts of a curing agent. And other auxiliary agents comprise the following components in parts by weight: 7-45 parts of a curing agent, 15-45 parts of a diluent, 0.5-5 parts of a surface modifier and 90-200 parts of hollow inorganic microbeads with silver-plated surfaces. The preparation method comprises the following steps: preparing the ceramic precursor modified epoxy resin; adding the surface-silvered hollow inorganic microbeads into the modified epoxy resin to prepare a component A; preparing other components B; and adding the