Electronic-grade copper-clad plate resin and preparation method thereof

• Main Authors: ZHANG LIANG, QU PENG, MA CHUAN, QI RUNSONG, XIONG GAOHU, LI CHENHONG
• Format: Patent
• Language: Chinese; English
• Published: 23.06.2023
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The invention relates to the technical field of resin preparation, in particular to electronic-grade copper-clad plate resin and a preparation method thereof. The preparation method of the electronic-grade copper-clad plate resin comprises the following steps: respectively dissolving bisphenol A epoxy resin, a polyethersulfone resin mixture, polyphenyl ether, toughened resin, heat-resistant resin and polyhedral oligomeric silsesquioxane in a solvent, mixing the obtained solutions, adding inorganic nanoparticles, a dispersing agent and a coupling agent, uniformly stirring, and carrying out vacuum drying to obtain the electronic-grade copper-clad plate resin. And performing rotary evaporation to remove the solvent to obtain the electronic-grade copper-clad plate resin. The cured product of the electronic-grade copper-clad plate resin provided by the invention has the advantages of good toughness, high Tg, high flame retardance, high toughness, high dimensional stability and low dielectric loss, and the inventio