Electronic-grade copper-clad plate resin and preparation method thereof

The invention relates to the technical field of resin preparation, in particular to electronic-grade copper-clad plate resin and a preparation method thereof. The preparation method of the electronic-grade copper-clad plate resin comprises the following steps: respectively dissolving bisphenol A epo...

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Bibliographic Details
Main Authors ZHANG LIANG, QU PENG, MA CHUAN, QI RUNSONG, XIONG GAOHU, LI CHENHONG
Format Patent
LanguageChinese
English
Published 23.06.2023
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Summary:The invention relates to the technical field of resin preparation, in particular to electronic-grade copper-clad plate resin and a preparation method thereof. The preparation method of the electronic-grade copper-clad plate resin comprises the following steps: respectively dissolving bisphenol A epoxy resin, a polyethersulfone resin mixture, polyphenyl ether, toughened resin, heat-resistant resin and polyhedral oligomeric silsesquioxane in a solvent, mixing the obtained solutions, adding inorganic nanoparticles, a dispersing agent and a coupling agent, uniformly stirring, and carrying out vacuum drying to obtain the electronic-grade copper-clad plate resin. And performing rotary evaporation to remove the solvent to obtain the electronic-grade copper-clad plate resin. The cured product of the electronic-grade copper-clad plate resin provided by the invention has the advantages of good toughness, high Tg, high flame retardance, high toughness, high dimensional stability and low dielectric loss, and the inventio
Bibliography:Application Number: CN202310560005