Fluorine-containing resin-based resin composition and application thereof

• Main Authors: MO ZIJIE, HAO LIANGPENG, LIANG WEI, CHAI SONGGANG
• Format: Patent
• Language: Chinese; English
• Published: 23.06.2023
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The invention provides a fluorine-containing resin-based resin composition and application thereof. The fluorine-containing resin-based resin composition is prepared from the following components in parts by weight: 20 to 70 parts of fluorine-containing resin and 30 to 70 parts of flame method silicon dioxide, the purity of the silicon dioxide is greater than 99.99%, and the average particle size D50 is 5-10 [mu] m. According to the fluorine-containing resin-based resin composition disclosed by the invention, lower dielectric loss and higher electrical strength are brought by the cooperation of the purity and the particle size of the silicon dioxide by a flame method, and the fluorine-containing resin-based resin composition has a lower dielectric constant, so that a substrate containing the fluorine-containing resin-based resin composition obtains more excellent comprehensive performance; and various performance requirements on the copper-clad plate material in the field of high-frequency communication are m