Ordered assembling method and application
The invention discloses a gelation induction ordered assembly method. According to the method, on the basis of electrostatic interaction between an assembly substrate and assembly elements, ordered assembly of the assembly elements is achieved. Specifically, a substrate capable of releasing charged...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
23.06.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a gelation induction ordered assembly method. According to the method, on the basis of electrostatic interaction between an assembly substrate and assembly elements, ordered assembly of the assembly elements is achieved. Specifically, a substrate capable of releasing charged particles is placed in an assembly liquid to obtain an ordered assembly material; the assembly liquid comprises an assembly element, and the assembly element can form electrostatic interaction with the charged particles. Furthermore, the orientation degree of the assembly material is further improved based on gel-induced orientation. According to the method, ordered assembly preparation and microstructure control of the nano material are simply and conveniently realized, and the nano composite materials with various forms and functions are prepared by taking the substrates with complex shapes and various materials as templates.
本发明公开了一种凝胶化诱导有序组装方法。该方法基于组装基底与组装基元之间的静电作用,实现组装基元的有序化组装。具体的,将可以释放带电粒子的基底置于组装液中,得到有序化组装的材料 |
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Bibliography: | Application Number: CN202211532321 |