Method for compensating for position error of wafer cutting blade

• Main Authors: LIU AN, PENG RUIBO
• Format: Patent
• Language: Chinese; English
• Published: 23.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

The invention provides a method for compensating a position error of a wafer cutting blade. The method comprises the following steps of: placing a wafer frame which is adhered with a cutting adhesive tape and is adhered with a wafer needing to be cut on the cutting adhesive tape on a sucking disc; a cutting blade is used for cutting a notch in the cutting adhesive tape blank area on the periphery of the wafer; a moving part on which the cutting blade is mounted moves the blade for an alignment distance, so that the camera moves to the position above the notch; determining a deviation distance between a center line of the cut and an alignment line in a lens of the camera; and re-determining the value of the blade alignment distance according to the deviation distance. According to the invention, the manufacturing cost of the chip can be greatly reduced, and the scribing efficiency of the wafer can be remarkably improved. 提供一种用于补偿晶圆切割刀片的位置误差的方法，包括：将粘附有切割胶带并且在切割胶带上贴附有需要被切割的晶圆的晶圆框架放置到吸盘上；利用切割刀片在晶圆外围的切割胶带空白区域上切割出切