Processing technology for increasing adhesive force of target material
The invention relates to the field of magnetron sputtering target material processing, in particular to surface metallization treatment on a target material, and particularly relates to a processing technology for increasing the adhesive force of the target material. The invention provides a process...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
09.06.2023
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The invention relates to the field of magnetron sputtering target material processing, in particular to surface metallization treatment on a target material, and particularly relates to a processing technology for increasing the adhesive force of the target material. The invention provides a processing technology for increasing the adhesive force of a target material. The processing technology comprises the following steps: carrying out pretreatment operation on the surface of the target material; coating a metal layer on the surface of the pre-treated target material; the pretreatment operation specifically comprises the steps of carrying out corona treatment on the surface of the target material, eroding the surface of the target material and forming a plasma active layer on the surface of the target material. According to the processing technology, before the surface of the target material is coated with the metal layer, the adhesive force of the surface of the target material is improved firstly, so that |
---|---|
Bibliography: | Application Number: CN202310263421 |