Mass transfer device and mass transfer method

• Main Authors: XIAO JUNLONG, YIN CHAOWEI
• Format: Patent
• Language: Chinese; English
• Published: 06.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to the technical field of semiconductor manufacturing, in particular to a mass transfer device and a mass transfer method. The multiple sets of clamping assemblies are arranged on the first side of the bearing plate, each set of clamping assembly comprises two clamping parts, and the clamping parts are allowed to expand or contract along with temperature changes so as to change the distance between the two clamping parts; and the temperature control assembly is arranged on the opposite second side of the bearing plate, is connected with the clamping assemblies and independently controls the temperature of each clamping assembly. According to the mass transfer method, the temperature of the clamping assembly is controlled through the temperature control assembly, deformation of the clamping assembly is changed, and clamping and releasing of the microchip element are achieved. The distance between the two clamping parts in the clamping assembly is adjusted through temperature changes, micr