Epoxy resin composition for normal-temperature curing wide temperature range as well as preparation method and application of epoxy resin composition

• Main Authors: LI SHENGCHAO, WANG XIAOLEI, HOU JINSEN, HAO XUFENG, WAN LI, JU BOWEN, TANG JINMEI, TIAN JIE
• Format: Patent
• Language: Chinese; English
• Published: 06.06.2023
• Subjects: ADHESIVES; ANTENNAS, i.e. RADIO AERIALS; BASIC ELECTRIC ELEMENTS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; ELECTRICITY; FILLING PASTES; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS THEREFOR; WOODSTAINS

The invention discloses an epoxy resin composition for a normal-temperature curing wide temperature range as well as a preparation method and application of the epoxy resin composition. The resin composition for the normal-temperature curing wide temperature range comprises the following components in parts by weight: A: 90-110 parts of bisphenol A epoxy resin, 30-40 parts of alicyclic epoxy resin and 35-50 parts of perovskite powder, and B: 30-40 parts of a curing agent. The method for preparing the resin material is simple and easy to implement, and the wide-temperature-range resin material obtained through compounding of bisphenol A epoxy resin and alicyclic epoxy resin, compounding of aliphatic amine, compounding of alicyclic amine and DDS (diaminodiphenyl sulfone) and compounding of the solution and perovskite powder can be used as a coating or a functional layer for construction at normal temperature; and after high-temperature post-treatment, the use temperature range can be expanded to-130 DEG C to +