METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT

• Main Authors: EMANUEL. PETIPREZ, GIBERT PHILIPPE, HUGON XAVIER, LEBEAU MICHAEL, POURQUIER ERIC, LACKAFF THOMAS, MAYEUR FREDERIC
• Format: Patent
• Language: Chinese; English
• Published: 02.06.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a method for manufacturing an optoelectronic device (1), comprising:-providing a support (3) supporting a plurality of three-dimensional semiconductor structures (2); forming a sacrificial portion (30) under the 3D structures (2a) of the first group (21) of the plurality of three-dimensional semiconductor structures (2); forming a barrier (50) around the sacrificial portion (30), the barrier (50) having a base wall (51) extending below the sacrificial portion (30) and a lateral wall (52) extending at an edge of the sacrificial portion (30); -forming a groove (132) for accessing the sacrificial portion (30) as far as possible, the accessing groove (132) extending continuously along the lateral wall (52) of the barrier (50); -etching the sacrificial portion (30) from the access trench (132); -removing the 3D structures (2a) of the first group (21). 本发明涉及一种用于制造光电器件(1)的方法，该方法包括：-提供支撑件(3)，所述支撑件(3)支撑多个三维半导体结构(2)；-在多个三维半导体结构(2)的第一组(21)的3D结构(2a)下方形成牺牲部(30)；-围绕牺牲部(30)形成阻挡部(50)，该阻挡部(50)具有在牺牲部(3