High density bezel for patch panel

The present application proposes a multi-port telecommunications bezel assembly comprising: a frame defining a first peripheral wall and at least one first inner wall, the first peripheral wall and the at least one first inner wall defining two rows of arrays of a plurality of jack socket openings e...

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Bibliographic Details
Main Authors WHITE GORDON JOHN, TOBEY SHAWN PHILLIP, FITZPATRICK BRIAN J
Format Patent
LanguageChinese
English
Published 02.06.2023
Subjects
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LINE CONNECTORS
SELECTING
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Summary:The present application proposes a multi-port telecommunications bezel assembly comprising: a frame defining a first peripheral wall and at least one first inner wall, the first peripheral wall and the at least one first inner wall defining two rows of arrays of a plurality of jack socket openings extending from a first open end to a second open end; and a metal bond strip secured to the frame and located between a first row and a second row of the two row arrays, the metal bond strip including a body from which a plurality of ground contact elements extend into each of the plurality of jack receptacle openings. 本申请提出了一种多端口电信边框组件，包括：框架，所述框架限定有第一外围壁和至少一个第一内壁，所述第一外围壁和至少一个第一内壁限定从第一开口端延伸到第二开口端的两排阵列的多个插孔插座开口；和固定到所述框架且位于所述两排阵列的第一排和第二排之间的金属结合条，所述金属结合条包括主体，多个接地接触元件从所述主体延伸到所述多个插孔插座开口的每一个中。
Bibliography:Application Number: CN202211664078